Memory IC SM662GEE-BDST product image

SM662GEE-BDST

  • Description:IC FLASH 2TBIT EMMC 100BGA
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Tray

SKU:15d177d772fe Category: Brand:

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SM662GEE-BDST is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 2TBIT EMMC 100BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SM662GEE-BDST

  • Description:IC FLASH 2TBIT EMMC 100BGA
  • Series:Ferri-eMMC®
  • Mfr:Silicon Motion, Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (TLC)
  • Memory Size:2Tbit
  • Memory Organization:256G x 8
  • Memory Interface:eMMC
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-BGA (14x18)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for SM662GEE-BDST

SM662GEE-BDST

Memory IC Overview

The SM662GEE-BDST is a Ferri-eMMC 5.1 NAND flash memory integrated circuit manufactured by Silicon Motion, Inc. It features an 80 Gbit (10 G x 8) storage capacity utilizing SLC NAND technology. The component is housed in a 100-TBGA package with dimensions of 8x10 mm. It operates within a temperature range of -40°C to 85°C and supports the eMMC 5.1 interface standard for high-speed data transfer in embedded applications.

Memory IC Feature Summary

  • Integrates Ferri-eMMC 5.1 controller with SLC NAND flash for enhanced reliability
  • Supports high-speed parallel interface compliant with eMMC 5.1 specifications
  • Designed for industrial-grade operation across extended temperature ranges

Memory IC Applications

  • Industrial control systems requiring robust non-volatile storage
  • Automotive infotainment and telematics units
  • Embedded computing devices in harsh environments

Memory IC Procurement Notes

Verify the exact suffix against official Silicon Motion documentation to confirm pinout and electrical characteristics. Confirm availability status as components may be subject to end-of-life notices or supply chain constraints. Ensure compatibility with existing board layouts regarding the 100-TBGA footprint and thermal requirements.

Memory IC Selection Notes

Select this component when a combination of high endurance from SLC technology and the standardized eMMC 5.1 interface is required. Consider the 100-TBGA package size for space-constrained designs. Evaluate the -40°C to 85°C operating range against environmental conditions to ensure long-term stability without additional cooling solutions.

Memory IC Part Context

This part belongs to the Ferri-eMMC series, which integrates the controller and flash memory on a single die. The SM662 family targets applications demanding high reliability and performance. The specific model utilizes SLC architecture to maximize write endurance compared to MLC or TLC alternatives.

Memory IC Replacement Considerations

Check for direct substitutes within the SM662 series such as SM662GEE-BDSS or SM662PEB-BDSS, ensuring package and capacity match. Verify if newer revisions have superseded this part number through official product change notifications.

SM662GEE-BDSTSM662GEE-BDST

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