SM662GXC BESS

$13.58

Description：IC FLASH 512GBIT EMMC 100BGA
Series：Ferri-eMMC®
Mfr：Silicon Motion, Inc.
Package：Tray

SKU:a41c8a92af23 Category: Memory IC Brand: Silicon Motion, Inc.

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Product introduction

SM662GXC BESS is listed in the Memory IC range at ChipApex. The manufacturer field lists Silicon Motion, Inc.. Its product description is IC FLASH 512GBIT EMMC 100BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for SM662GXC BESS

Description：IC FLASH 512GBIT EMMC 100BGA
Series：Ferri-eMMC®
Mfr：Silicon Motion, Inc.
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (SLC)
Memory Size：512Gbit
Memory Organization：64G x 8
Memory Interface：eMMC
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-25°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：100-LBGA
Supplier Device Package：100-BGA (14x18)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for SM662GXC BESS

SM662GXC BESS

Memory IC Overview

The SM662GXC-BESS is a Ferri-eMMC flash memory component manufactured by Silicon Motion, Inc. It utilizes 3D TLC NAND technology and supports the eMMC 5.1 interface standard. The device is housed in a 100-LBGA package with dimensions of 14x18 mm. It offers a storage capacity of 160 Gbit (20 GB) and operates within an extended temperature range of -40°C to +85°C.

Memory IC Feature Summary

Integrates built-in wear leveling for enhanced endurance
Includes bad block management functionality
Features hardware ECC error correction

Memory IC Applications

Industrial embedded systems requiring wide temperature tolerance
Consumer electronics utilizing eMMC 5.1 interfaces
IoT devices needing compact BGA-100 form factor storage

Memory IC Procurement Notes

Verify the specific suffix BESS against official Silicon Motion documentation to confirm exact configuration and availability status. Ensure compatibility with host controllers supporting eMMC 5.1 standards before procurement. Cross-reference package dimensions and thermal specifications with target design requirements.

Memory IC Selection Notes

Select this component when a robust, low-profile storage solution is required for environments operating between -40°C and +85°C. The 100-LBGA package suits space-constrained designs. Confirm that the host system supports the necessary eMMC 5.1 protocol and voltage levels associated with this specific Silicon Motion controller.

Memory IC Part Context

This part belongs to the Ferri-eMMC series from Silicon Motion, designed for high-density, cost-effective storage applications. The SM662GXC-BESS variant specifically targets markets demanding reliable performance in harsh conditions through its extended temperature rating and integrated reliability features like wear leveling.

Memory IC Replacement Considerations

Direct substitutes are not explicitly confirmed in public data. Evaluate other SM662 series variants or comparable eMMC 5.1 controllers from Silicon Motion based on pinout compatibility and interface support.