SM662PAC-BDST

Memory IC Overview

The SM662PAC-BDST is a NAND flash memory integrated circuit manufactured by Silicon Motion, Inc. It utilizes 3D TLC configuration and supports the eMMC 5.1 interface standard. The device offers a total memory capacity of 512 Gbit (64 GB) and is housed in a 100-LBGA package with dimensions of 11.5x13 mm. It is designed for surface mount technology applications.

Memory IC Feature Summary

• Supports eMMC 5.1 interface protocol
• Utilizes 3D TLC NAND flash technology
• Integrated controller architecture

Memory IC Applications

• Mobile devices
• Consumer electronics
• Embedded systems

Memory IC Procurement Notes

Verify the specific package type and pinout against the official datasheet before procurement. Confirm that the 100-LBGA footprint matches your PCB design requirements. Ensure compatibility with eMMC 5.1 host controllers. Check for RoHS compliance status if required by your manufacturing standards. Validate the memory density specifications to ensure they meet system storage needs.

Memory IC Selection Notes

Select this component when a compact eMMC solution with 64 GB capacity is required. The 100-LBGA package suits space-constrained designs. Consider the 3D TLC technology for balanced performance and cost. Verify host controller support for eMMC 5.1 features. Evaluate thermal management requirements for the BGA package in the final enclosure design.

Memory IC Part Context

Silicon Motion specializes in NAND flash controllers for solid-state storage. This part belongs to their embedded multimedia card product line. The SM662 series integrates controller and memory for simplified system design. It targets high-volume consumer and mobile markets requiring reliable non-volatile storage solutions.

Memory IC Replacement Considerations

Check for direct substitutes within the SM662 family. Verify pin-to-pin compatibility with existing designs. Ensure equivalent memory density and interface versions. Review updated datasheets for any functional changes in newer revisions.