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SN74ABT3611-15PCB is listed in the FIFOs Memory range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FIFO SYNC 64X36 120HLQFP. Review the specifications below when checking this part for your BOM.
The SN74ABT3611-15PCB is a synchronous bi-directional FIFO memory device from Texas Instruments' 74ABT series. It features a data bus width of 36 bits and an organization of 64 words by 36 bits with two independent circuits, totaling 4.5 kbit storage capacity. The component operates within a supply voltage range of 4.5 V to 5.5 V and supports a maximum clock frequency of 66.7 MHz with a typical access time of 10 ns. It is housed in a 120-pin BQFP package suitable for surface mount installation.
Verify the specific suffix -15PCB against the official Texas Instruments datasheet to confirm pinout compatibility and electrical characteristics. Ensure the procurement source provides genuine components with traceable documentation. Check for moisture sensitivity levels and recommended reflow soldering profiles prior to assembly to prevent package damage during manufacturing processes.
Select this component when designing systems requiring wide data paths and synchronous operation at frequencies up to 66.7 MHz. Consider the 120-pin BQFP package constraints for PCB layout and thermal management. Evaluate power consumption specifications relative to system requirements, as ABT logic families typically draw higher static current compared to lower voltage CMOS alternatives.
This part belongs to the SN74ABT3614 family of synchronous FIFOs, designed for high-performance applications. The 74ABT series utilizes BiCMOS technology to achieve speed comparable to ALS logic with power consumption similar to LS logic. This specific variant offers a 10 ns access time, distinguishing it from slower variants in the same product line.
Direct replacements include other SN74ABT361x variants with compatible pinouts and timing specifications. Verify that substitute parts match the 36-bit width and 66.7 MHz operational frequency requirements. Cross-reference package dimensions and thermal characteristics to ensure mechanical fit without redesigning the host circuit board.
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