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SN74ALS638AN is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSCEIVER INVERT 5.5V 20DIP. Review the specifications below when checking this part for your BOM.
The SN74ALS638AN is an octal bus transceiver from the Texas Instruments ALS logic family, housed in a 20-pin PDIP package. It features three-state outputs and operates within a supply voltage range of 4.5 V to 5.5 V. The device supports TTL input and output levels, with a propagation delay of 30 ns. It provides a low-level output current of 24 mA and a high-level output current of -15 mA. Designed for through-hole mounting, it functions as an inverting transceiver suitable for standard industrial temperature ranges.
Verify the specific ordering suffix to confirm the package type and RoHS compliance status, as variations exist within the SN74ALS638A series. Confirm that the required lead times align with production schedules, noting that availability may vary by region. Ensure the selected component meets the environmental specifications for the intended operating temperature range before finalizing procurement.
Select this component when an octal, inverting bus transceiver with TTL compatibility is required. The ALS series offers improved speed and power consumption compared to standard LS logic. Verify that the 30 ns propagation delay meets the timing constraints of the target application. Ensure the PCB layout accommodates the 20-pin DIP footprint and that the power supply decoupling supports the specified current requirements.
This part belongs to the Texas Instruments SN74ALS638A/39A family of high-speed Schottky logic devices. These components are designed for applications demanding faster switching speeds than standard LS logic while maintaining lower power dissipation. The SN74ALS638AN specifically denotes the plastic dual-in-line package variant manufactured by Texas Instruments.
The SN74ALS638ADWE4 is a documented surface-mount alternative within the same functional family. Verify pinout compatibility and package dimensions when transitioning between through-hole and surface-mount technologies.
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