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SN74HCT273APW is listed in the Flip Flops range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC FF D-TYPE SNGL 8BIT 20TSSOP. Review the specifications below when checking this part for your BOM.
The SN74HCT273APWR is an octal D-type flip-flop from the Texas Instruments 74HCT logic family, housed in a 20-TSSOP package. It features positive-edge triggering and a master reset function. The device operates within a supply voltage range of 4.5V to 5.5V. Key electrical parameters include a maximum propagation delay of 29ns at 5.5V with 50pF load, a maximum clock frequency of 37 MHz, and output currents of 4mA for both high and low states. Static current consumption is 8 µA. The component supports surface-mount installation and functions across a temperature range of -40°C to 85°C.
Verify the specific suffix designation when ordering, as variations such as 'PWR' indicate tape-and-reel packaging while 'PW' denotes tube packaging. Confirm that the required operating temperature range aligns with the commercial grade specifications. Ensure compatibility with the target PCB footprint dimensions for the 20-TSSOP package before finalizing procurement decisions.
Select this component when designing systems requiring multiple synchronized storage elements driven by a common clock source. The HCT series compatibility makes it suitable for legacy designs utilizing 5V logic levels. Consider the propagation delay characteristics against system timing requirements to ensure reliable data integrity during high-speed operations.
This part belongs to the widely adopted 74HCT logic family, which bridges CMOS technology with TTL input standards. The SN74HCT273 variant specifically addresses applications needing parallel data retention. Its design supports robust performance in general-purpose digital electronics, offering a balance between speed and power efficiency for industrial and consumer applications.
The SN74HCT273PWR serves as a direct functional substitute, differing primarily in reel-based packaging rather than internal circuitry. Designers should verify pinout consistency and electrical parameter equivalence before swapping components to maintain board layout integrity.
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