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SN74LS367ANG4 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 5.25V 16DIP. Review the specifications below when checking this part for your BOM.
The SN74LS367ANG4 is a hex bus driver featuring three-state outputs, manufactured by Texas Instruments. It operates within the LS logic series and utilizes a 16-pin PDIP package. The device accepts a supply voltage range of 4.75 V to 5.25 V. Key electrical parameters include a low-level output current of 24 mA and a high-level output current of -2.6 mA. Propagation delay is specified at 22 ns when operating at 5 V. The component supports a maximum operating temperature of +70 °C.
Verify the specific suffix 'G4' against the manufacturer's official documentation to confirm lead-free compliance and RoHS status. Ensure the ordering part number matches the exact package style required for your PCB layout. Cross-reference the datasheet revision date to confirm parameter accuracy before finalizing procurement specifications.
Select this component when a hex buffer with three-state capability is required for bus isolation. The LS logic family offers a balance of speed and power consumption suitable for general-purpose digital applications. Verify that the system voltage remains strictly within the 4.75 V to 5.25 V range to ensure reliable operation and prevent damage to the internal circuitry.
This component belongs to the SN74LS367A series of hex bus drivers. It is functionally equivalent to other manufacturers' 74LS367 devices but adheres to Texas Instruments' specific manufacturing standards. The 'G4' designation typically indicates environmental compliance features, such as being lead-free, distinguishing it from standard commercial variants.
Compatible substitutes include the SN74LS367AN (standard PDIP variant) and generic 74LS367 parts from other vendors like ON Semiconductor or National Semiconductor. Ensure any replacement maintains the same 16-pin PDIP footprint and three-state output functionality.
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