SN74LVTH322374KR

Flip Flops Overview

The SN74LVTH322374KR is a 3.3-V ABT octal D-type flip-flop with 3-state outputs, manufactured by Texas Instruments. It operates within a supply voltage range of 2.7 V to 3.6 V. The device features four independent 8-bit registers, totaling 32 bits. Key electrical parameters include a propagation delay of 2.9 ns, high-level output current of -32 mA, and low-level output current of 64 mA. It functions in a temperature range from -40°C to +85°C and utilizes a 96-pin LFBGA package.

Flip Flops Feature Summary

• Contains four independent 8-bit registers for 32-bit data storage
• Features 3-state outputs for bus-driven applications
• Operates at 3.3-V supply voltage with ABT technology

Flip Flops Applications

• High-speed digital data buffering
• Bus-oriented memory systems
• Parallel-to-serial conversion circuits

Flip Flops Procurement Notes

Verify the specific package type and tape/reel specifications against the manufacturer's latest datasheet before ordering. Ensure compatibility with your system's voltage levels and thermal requirements. Confirm that the component meets all necessary regulatory standards for your intended application environment.

Flip Flops Selection Notes

Select this component when a 32-bit wide register with 3-state capability is required. It is suitable for designs needing fast switching speeds at 3.3 V. Consider the pin count and package size constraints when choosing between this LFBGA option and other available packages in the series.

Flip Flops Part Context

This part belongs to the SN74LVTH322374 family of logic ICs. It is an advanced BJT (ABT) technology device designed for high-speed operation. The series offers various packaging options to suit different board space and connectivity needs while maintaining consistent electrical performance characteristics.

Flip Flops Replacement Considerations

Check for direct pin-compatible substitutes within the same LVTH series. Verify that any alternative maintains the 3.3-V operating voltage and 32-bit width. Ensure the replacement package matches the physical footprint if board rework is not planned.