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SNJ54HC153FK is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is 54HC153 DUAL 4-LINE TO 1-LINE DA. Review the specifications below when checking this part for your BOM.
The SNJ54HC153FK is a dual 4-line to 1-line data selector/multiplexer manufactured by Texas Instruments. It operates within a supply voltage range of 2 V to 6 V and supports an operating temperature range from -55 °C to 125 °C. The device features full binary decoding to select one of four data sources per channel, with both channels sharing common address select inputs (A and B). Each channel includes an independent strobe (enable) input that forces the respective output low when high. The component utilizes a 20-pin Leadless Ceramic Chip Carrier (LCCC) package.
Verify the specific ordering suffix FK corresponds to the 20-pin LCCC package configuration. Confirm the RoHS status and lead finish details against the latest TI Package Option Addendum, as manufacturing parameters may update. Ensure the procurement documentation explicitly lists the -55 °C to 125 °C military-grade temperature rating required for the application environment.
Select this component when dual independent 4-to-1 multiplexing is required within a single integrated circuit. The HC technology offers compatibility with standard CMOS logic levels across a wide voltage range. Consider the LCCC package for applications requiring hermetic sealing or high thermal stability in harsh environments compared to plastic packages.
This part belongs to the SNx4HC153 family of dual multiplexers. The 'SNJ' prefix indicates a military-grade qualification level, while the 'FK' suffix designates the specific 20-pin LCCC ceramic package. It shares functional equivalence with other variants like SN54HC153J but differs in physical form factor and packaging material.
Direct pin-compatible replacements include SNJ54HC153J (CDIP package) and SNV54HC153W (CFP package), provided the mechanical footprint and thermal requirements align with the system design constraints.
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