SY89222LMG-TR

Translators, Level Shifters Overview

The SY89222LMG-TR is a dual TTL-to-differential LVPECL translator operating from a single +3.3V power supply. It features PNP TTL inputs for minimal loading and differential LVPECL outputs. The device provides a typical propagation delay of 300ps and less than 100ps output-to-output skew. It is housed in an ultra-small 8-pin MLF package measuring 2mm x 2mm, suitable for applications requiring clock and data signal translation.

Translators, Level Shifters Feature Summary

• Dual gate design translating TTL to differential LVPECL
• Ultra-small 8-lead MLF package with 70% smaller footprint
• Low skew performance ideal for clock and data signals

Translators, Level Shifters Applications

• Clock and data signal translation
• System board interconnects
• High-speed digital interfaces

Translators, Level Shifters Procurement Notes

Verify the specific ordering suffix 'MG' indicates Pb-Free finish with NiPdAu leads as documented in the official datasheet. Confirm the package type matches the 8-lead MLF specification. Ensure compatibility with industrial temperature ranges if required by the application environment.

Translators, Level Shifters Selection Notes

Select this component when space constraints require an ultra-small footprint for dual-channel translation. It serves as a functional equivalent to older SOIC packages while maintaining LVPECL compatibility. Consider the single +3.3V supply requirement and input/output voltage levels during circuit design.

Translators, Level Shifters Part Context

This part belongs to Micrel's Precision Edge family of high-speed logic translators. Originally manufactured by Micrel, Inc., it is now part of Microchip Technology's portfolio following acquisition. The device maintains backward compatibility with previous generations while offering improved packaging density.

Translators, Level Shifters Replacement Considerations

The SY100ELT22L is functionally equivalent but utilizes an 8-SOIC package. Verify pinout compatibility and package dimensions before substitution to ensure mechanical fit on the PCB layout.