Microcontrollers, Microprocessor, FPGA Modules TE0720-03-62I33ML product image

TE0720-03-62I33ML

  • Description:IC SOC MODULE XILINX ZYNQ
  • Series:TE0720

SKU:d33e680a7b94 Category: Brand:

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TE0720-03-62I33ML is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is IC SOC MODULE XILINX ZYNQ. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for TE0720-03-62I33ML

  • Description:IC SOC MODULE XILINX ZYNQ
  • Series:TE0720
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7020)
  • Speed:-
  • Flash Size:8GB
  • RAM Size:1GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for TE0720-03-62I33ML

TE0720-03-62I33ML

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0720-03-62I33ML is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z020. It features a dual-core ARM Cortex-A9 MPCore processing system and an Artix-7 programmable logic fabric with 85K logic cells. The module integrates up to 1 GB of DDR3/L SDRAM, 32 MB of Quad SPI flash memory, and supports eMMC storage options up to 32 GB. Connectivity includes a Gigabit Ethernet PHY (Marvell 88E1512), USB 2.0 ULPI transceiver, and JTAG interfaces. It utilizes rugged Samtec LSHM stacking connectors for board-to-board interfacing.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Xilinx Zynq XC7Z020 SoC with Dual-core ARM Cortex-A9 and 85K Artix-7 PL cells
  • Up to 1 GB DDR3/L SDRAM and 32 MB Quad SPI Flash
  • Integrated Marvell 88E1512 Gigabit Ethernet PHY and Microchip USB3320C ULPI PHY
  • System Controller CPLD (Lattice LCMXO2-1200HC) for power management and peripheral control

Microcontrollers, Microprocessor, FPGA Modules Applications

  • Industrial automation controllers requiring asymmetric multiprocessing
  • Video processing systems utilizing HDMI I/O and FPGA accelerators
  • Embedded computing platforms needing secure boot and MAC address storage

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify component availability as supply status may be restricted or limited. Confirm specific memory configurations and assembly options directly with the manufacturer, as variants differ in eMMC capacity and optional peripherals like the eCompass module.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module for applications requiring industrial temperature ranges and high vibration resistance. Ensure carrier board design supports the required power sequencing and provides 3.3V input with sufficient current capability. Verify that the specific variant matches the required SoC model (XC7Z020 vs XC7Z014S) and memory size.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the TE0720 family of 4x5 cm System on Modules designed by Trenz Electronic. It is part of the TRM series, indicating specific revision and feature sets. The module is intended for integration into custom carrier boards via Board-to-Board connectors.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Check for other TE0720 variants with different SoC models (e.g., XC7Z014S) or memory configurations if pin compatibility is maintained. Consider the TE0729 series for similar form factors with potentially different peripheral integrations.

TE0720-03-62I33MLTE0720-03-62I33ML

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