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TL064IDT is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC OPAMP JFET 4 CIRCUIT 14SO. Review the specifications below when checking this part for your BOM.
The TL064IDT is a quad JFET input operational amplifier manufactured by STMicroelectronics in a SOIC-14 package. It features a gain-bandwidth product of 1 MHz and a slew rate of 3.5 V/us. The device operates with a maximum supply voltage of 36 V and consumes 200 uA per amplifier. Input characteristics include a bias current of 200 pA, offset voltage of 6 mV, and noise density of 42 nV/sqrt Hz. Common-mode rejection ratio is 80 dB. Operating temperature range spans from -40 C to +105 C.
Verify the specific suffix IDT indicates tape and reel packaging when sourcing. Confirm RoHS compliance status through official manufacturer documentation or authorized distributor declarations. Ensure the SOIC-14 package variant matches the design footprint requirements. Cross-reference the active status with the latest STMicroelectronics product lifecycle notices.
Select this component for applications requiring low input bias current and high input impedance. The JFET input stage makes it suitable for high-impedance sensor interfaces. Consider the 1 MHz bandwidth and 3.5 V/us slew rate for moderate speed signal conditioning tasks. Evaluate power consumption constraints against the 200 uA per channel specification.
This part belongs to the TL064 family of high-speed JFET input operational amplifiers. The family includes single (TL064), dual (TL064C), and quad (TL064) variants. The TL064IDT specifically denotes the quad version in surface-mount packaging. It shares core electrical characteristics with other members of the series, differing primarily in channel count and physical package.
Check for direct pin-compatible alternatives within the same JFET input op-amp category. Verify that substitute parts maintain similar input bias current and bandwidth specifications. Ensure thermal performance and package dimensions match the existing PCB layout constraints.
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