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TLC279CN is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC CMOS 4 CIRCUIT 14DIP. Review the specifications below when checking this part for your BOM.
The TLC279CN is a precision LinCMOS quad operational amplifier manufactured by Texas Instruments. It features four independent channels within a single 14-pin PDIP package. Key electrical specifications include a gain-bandwidth product of 2.2 kHz, a slew rate of 3.6 V/us, and an input offset voltage of 320 uV. The device operates on a supply voltage range from 3 V to 16 V with a typical operating current of 2.7 mA. It offers a common-mode rejection ratio of 80 dB and an input voltage noise density of 25 nV/sqrt Hz.
Verify the specific suffix 'CN' corresponds to the standard PDIP-14 through-hole package variant. Confirm RoHS compliance status as detailed in the official datasheet documentation. Ensure the ordering part number matches the exact temperature grade and packaging format required for the design. Cross-reference the manufacturer's latest product change notifications for any material or process updates.
Select this component when a quad amplifier topology is required alongside moderate precision and low power constraints. The 2.2 kHz bandwidth suits applications where speed is secondary to accuracy and stability. Consider the 320 uV offset voltage for DC-coupled signals. Evaluate the 30 mA per-channel output drive against load requirements. Compare against other family members if higher bandwidth or lower noise is necessary.
This device belongs to the TLC279 series of precision operational amplifiers. It utilizes Texas Instruments' proprietary LinCMOS technology, which combines the benefits of CMOS low power with bipolar-like precision. The quad architecture provides multiple amplifier channels in a single footprint, reducing board space compared to individual dual packages.
TLC279IDR is a documented alternative offering the same functional characteristics in a surface-mount SOIC-14 package. Verify pin compatibility and thermal dissipation differences when transitioning between through-hole and surface-mount technologies.
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