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TLP781(D4,F) is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLATOR 5KV 1CH TRANS 4-DIP. Review the specifications below when checking this part for your BOM.
The TLP781(D4,F) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates a Gallium Arsenide infrared emitting diode with a silicon phototransistor in a four-lead plastic DIP package featuring a 10.16mm pitch. The device provides high isolation voltage of 5000V RMS minimum, collector-emitter breakdown voltage of 80V minimum, and a current transfer ratio of 50% minimum. Operating temperature range spans from -25°C to 85°C.
Verify the specific suffix designation against official Toshiba documentation to confirm pin pitch and packaging configuration. Ensure the ordered component matches the required isolation voltage ratings and operating temperature specifications for the target application environment. Cross-reference part numbers with authorized distributors to confirm authenticity and compliance with current manufacturing standards.
Select this component when high isolation voltage and compact DIP packaging are required for transistor-level signal coupling. Consider the current transfer ratio and switching speed characteristics relative to the driving circuit requirements. Evaluate thermal management needs within the specified operating temperature range during system integration.
This component belongs to the TLP781 series of optocouplers designed for general-purpose isolation applications. The family includes variants with different pin pitches and packaging options to accommodate various board layout constraints. These devices are engineered for robust performance in consumer electronics and industrial control systems requiring electrical separation.
Compatible substitutes include TLP781(D4,GB,TP6) and TLP781F. Verify pin compatibility and electrical parameter equivalence before substitution. Confirm that alternative components meet the same isolation voltage and current transfer ratio specifications.
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