TPA6111A2DGN

$1.45

Description：IC AMP CLASS AB STER 150MW 8MSOP
Series：-
Mfr：Texas Instruments
Package：Bulk,Tube

SKU:36075bb311f1 Category: Audio Amplifiers Brand: Texas Instruments

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Product introduction

TPA6111A2DGN is listed in the Audio Amplifiers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC AMP CLASS AB STER 150MW 8MSOP. Review the specifications below when checking this part for your BOM.

Audio Amplifiers specifications for TPA6111A2DGN

Description：IC AMP CLASS AB STER 150MW 8MSOP
Series：-
Mfr：Texas Instruments
Package：Bulk,Tube
Type：Class AB
Output Type：Headphones, 2-Channel (Stereo)
Max Output Power x Channels @ Load：150mW x 2 @ 16Ohm
Voltage - Supply：2.5V ~ 5.5V
Features：Depop, Short-Circuit and Thermal Protection, Shutdown
Mounting Type：Surface Mount
Supplier Device Package：8-HVSSOP
Package / Case：8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Operating Temperature：-40°C ~ 85°C (TA)
Grade：-
Qualification：-

Audio Amplifiers datasheet and documents for TPA6111A2DGN

TPA6111A2DGN

Audio Amplifiers Overview

The TPA6111A2DGN is a stereo headphone amplifier from Texas Instruments, operating in Class-AB topology. It delivers 150 mW of output power into an 8-ohm load with a total harmonic distortion plus noise of 0.6%. The device functions on a single supply voltage ranging from 2.5 V to 5.5 V and draws a typical quiescent current of 1.6 mA. It features a shutdown mode for power management and operates within a temperature range of -40°C to +85°C. The component is housed in an 8-pin HVSSOP package.

Audio Amplifiers Feature Summary

Stereo audio amplification optimized for low-voltage portable applications
Integrated shutdown control for extended battery life
Pin-compatible design facilitating direct upgrades from legacy components

Audio Amplifiers Applications

Portable media players
Mobile phones
Personal digital assistants

Audio Amplifiers Procurement Notes

Verify the specific suffix DGN confirms the 8-pin HVSSOP package variant rather than standard SOIC or MSOP options. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the selected revision matches the required thermal performance specifications for the target enclosure environment.

Audio Amplifiers Selection Notes

Select this component when a pin-compatible replacement for LM4880 or LM4881 is required in compact designs. The 8-pin HVSSOP package suits space-constrained PCB layouts compared to larger SOIC footprints. Evaluate the 150 mW output capability against the specific impedance requirements of the connected headphones to ensure adequate drive levels without excessive power consumption.

Audio Amplifiers Part Context

This part belongs to the TPA6111A2 series of stereo headphone amplifiers designed for mobile electronics. It serves as a direct upgrade path for older linear amplifier designs, offering improved efficiency and lower power consumption while maintaining compatibility with existing board layouts. The series supports various packaging options to accommodate different assembly constraints.