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VNN3NV0413TR is listed in the Power Distribution Switches, Load Drivers range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC PWR DRIVER N-CHAN 1:1 SOT223. Review the specifications below when checking this part for your BOM.
The VNN3NV0413TR is a monolithic OMNIFET II device from STMicroelectronics, built on VIPower M0-3 technology. It integrates a low-side N-channel power MOSFET with gate driver and protection circuits in an SOT-223 package. Key electrical parameters include a drain-source voltage of 40V, an on-resistance of 120mOhm, and a peak output current of 3.5A. The component operates within a temperature range of -40°C to +150°C, features rise and fall times of 250ns, and draws a typical operating supply current of 100uA.
Verify the specific ordering suffix and manufacturer part number against official STMicroelectronics documentation to ensure correct variant selection. Confirm that the requested component matches the intended electrical specifications and package type. Check for any product termination notifications or lifecycle status updates prior to finalizing procurement decisions.
Select this component when integrated protection features such as thermal shutdown and short-circuit protection are required. It is suitable for designs needing diagnostic feedback capabilities via the input pin. Ensure the application voltage and current requirements align with the 40V and 3.5A ratings respectively.
This part belongs to the OMNIFET II family, designed to replace discrete power MOSFETs by combining drive and protection functions. It utilizes STMicroelectronics' VIPower M0-3 technology for high reliability. The device simplifies circuit design by reducing external component count while enhancing system safety in automotive and industrial applications.
Public confirmed substitute part numbers: VNN3NV04PTR-E, VND3NV04, VNS3NV04.
Fault feedback is detected by monitoring the voltage at the input pin, allowing the system to identify issues such as overcurrent or overheating.
The device includes thermal shutdown, linear current limitation, and an integrated overvoltage clamp to protect the chip in harsh environments.
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