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The VSM-08-20-200-50-03-N is a vertical male board stacking connector from the AirBorn verSI series. It features a 1.27 mm pitch and is configured with 8 rows and 20 columns, providing 160 positions. The unit utilizes a plastic body constructed from liquid crystal polymer (LCP) and employs through-hole termination for PCB mounting. Gold plating is applied to phosphor bronze contacts. The design supports a board spacing of 200 mm and operates within a temperature range of -55°C to +125°C.
Verify the specific suffix codes against official Molex/AirBorn documentation to confirm exact termination style and plating specifications. Ensure compatibility with mating receptacles regarding row count and column alignment. Confirm that the selected variant meets all necessary environmental and regulatory compliance requirements for the intended deployment environment before finalizing procurement orders.
Select this component when a vertical male interface is required for board-to-board connections. The 1.27 mm pitch allows for high pin density in constrained spaces. Verify that the 200 mm board spacing requirement matches the system architecture. Ensure the through-hole termination method aligns with the manufacturing capabilities of the target printed circuit board assembly process.
This part belongs to the AirBorn verSI rectangular connector family, which adheres to MIL-DTL-83513 standards. The series provides modular configurations for various military and industrial applications. The VSM designation specifically indicates a vertical male plug configuration within this standardized ecosystem.
Direct substitutes must match the 1.27 mm pitch, 8-row by 20-column layout, and vertical male orientation. Verify identical board spacing and termination methods to ensure mechanical fit. Cross-reference with other manufacturers offering MIL-DTL-83513 compliant equivalents if original supply is unavailable.

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