SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSRAF-05-50-50-00-N is a rectangular MIL-Spec connector from the AirBorn verSI series, manufactured by Molex. It functions as a receptacle with 250 positions arranged in 5 rows and 50 columns. The component utilizes a press-fit termination method for board mounting and features right-angle installation. Contacts are female sockets with gold plating, operating on a 1.27 mm (0.050 inch) pitch. The unit complies with MIL-DTL-83513 standards.
Verify the specific suffix 'N' against the official datasheet to confirm material composition and environmental ratings. Ensure the receiving facility accepts press-fit receptacles for the target PCB stack-up. Confirm that the right-angle orientation matches the mechanical layout constraints of the assembly.
Select this part when a high-density, right-angle MIL-Spec receptacle is required. The press-fit option eliminates soldering requirements, reducing thermal stress on the board. Verify that the 5-row, 50-column layout fits within the available panel area and aligns with mating plug specifications.
This component belongs to the AirBorn verSI family, known for high-density interconnect solutions. The VSRAF designation indicates a right-angle receptacle with press-fit contacts. It is designed for applications demanding reliability under harsh conditions, adhering to strict military performance standards.
Cross-reference with other VSRAF-05-50-50-00 variants if different contact materials or body styles are needed. Ensure any substitute maintains the same 250-position count and MIL-DTL-83513 compliance for interchangeability.

Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More