SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSRAM-05-10-50-04-N is a high-speed rectangular connector from the AirBorn VSRAM series, manufactured by Molex. It features a 50-position header configuration with male pins designed for through-hole mounting at a right angle. The connector utilizes a 1.27 mm pitch and includes board guide features for precise alignment during assembly.
Verify the specific suffix 'N' to confirm non-rohs or specific environmental compliance status as per the manufacturer's current documentation. Confirm that the right-angle orientation matches the PCB layout requirements. Ensure the 1.27 mm pitch aligns with the target footprint. Check for any recent brand transition notices regarding AirBorn to Molex labeling on packaging.
Select this component when a high-density, right-angle interconnect is required for high-speed applications. The 50-position count suits moderate density needs. The through-hole technology ensures robust mechanical retention. Verify that the board guide feature is compatible with the assembly line equipment used for placement.
This part belongs to the VSRAM family of high-speed connectors known for reliability in harsh environments. The series supports various pin counts and orientations. As an AirBorn product now under Molex, it maintains Mil-Spec heritage while adhering to modern manufacturing standards. The VSRAM designation indicates specific performance characteristics distinct from standard commercial connectors.
Direct substitutes must match the 50-position count, 1.27 mm pitch, and right-angle through-hole form factor. Verify compatibility with existing board guides. Cross-reference with other AirBorn/Molex VSRAM variants if pin count differs. No generic equivalents are confirmed without detailed electrical and mechanical validation.
September 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More