SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSRAM-10-20-50-03-N is a rectangular military specification connector from the AirBorn verSI series, manufactured by Molex. It is designed as a receptacle with a plastic body and right-angle orientation. The component utilizes press-fit termination for board mounting and features fixed jacknuts to accommodate a maximum board thickness of 0.125 inches. The connector configuration includes 20 columns and 10 rows, providing a total of 200 circuits. Contact surfaces are gold-plated sockets.
Verify the specific datasheet version for the VSRAM-10-20-50-03-N to confirm current manufacturing status and compliance certifications. Ensure that the receiving facility has the necessary tooling for press-fit installation. Confirm that the application board thickness does not exceed the 0.125-inch limit specified for the fixed jacknuts. Cross-reference the MIL-DTL-83513 requirements with the project specifications to ensure full regulatory adherence before finalizing procurement orders.
Select this component when a right-angle, high-density connection is required in a military-grade environment. The press-fit termination offers superior vibration resistance compared to solder-only methods. Verify that the 200-circuit capacity matches the system signal count. Ensure compatibility with the mating plug series within the AirBorn verSI family. Consider the plastic body material properties against environmental exposure limits.
This part belongs to the AirBorn verSI series, which provides high-density interconnect solutions compliant with MIL-DTL-83513 standards. The series supports various configurations including plugs and receptacles with different termination styles. The VSRAM variant specifically addresses applications requiring right-angle mounting and robust mechanical retention through fixed hardware.
Direct substitutes must match the 200-position count, 1.27mm pitch, and right-angle press-fit characteristics. Verify equivalent MIL-DTL-83513 compliance. Check for identical jacknut specifications and contact plating requirements.

WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More