W25Q01NWSFIM TR

$8.00

Description：IC FLASH 1GBIT SPI/QUAD 16SOIC
Series：SpiFlash®
Mfr：Winbond Electronics
Package：Tape & Reel (TR)

SKU:894caecb66ae Category: Memory IC Brand: Winbond Electronics

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Product introduction

W25Q01NWSFIM TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 1GBIT SPI/QUAD 16SOIC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25Q01NWSFIM TR

Description：IC FLASH 1GBIT SPI/QUAD 16SOIC
Series：SpiFlash®
Mfr：Winbond Electronics
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR
Memory Size：1Gbit
Memory Organization：128M x 8
Memory Interface：SPI - Quad I/O, QPI
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：3ms
Voltage - Supply：1.7V ~ 1.95V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：16-SOIC (0.295", 7.50mm Width)
Supplier Device Package：16-SOIC
Access Time：7 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for W25Q01NWSFIM TR

W25Q01NWSFIM TR

Memory IC Overview

The W25Q01NWSFIM TR is a 1G-bit (128M-byte) Serial Flash memory device manufactured by Winbond Electronics. It features a dual-die architecture comprising two stacked 512M-bit dies, supporting linear addressing across the full memory range. The device operates on a single 1.7V to 1.95V power supply and supports Standard, Dual, and Quad SPI interfaces with clock frequencies up to 133MHz. It utilizes a 16-pin SOIC 300-mil package and includes advanced security features such as hardware write protection and individual block locking.

Memory IC Feature Summary

Dual-die stack architecture enabling linear addressing for the complete 1G-bit capacity
Supports Standard, Dual, and Quad SPI protocols with high-speed data transfer capabilities
Integrated hardware and software write protection mechanisms including dedicated /WP pin
Advanced security features including unique serial numbers and OTP-locked security registers

Memory IC Applications

Code shadowing to RAM for system initialization
Execute In Place (XIP) operations via Dual/Quad SPI
Storage of voice, text, and data in space-constrained systems

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet revision to confirm package type and electrical characteristics. Ensure compatibility with the required voltage range and interface mode. Confirm availability status directly with the manufacturer or authorized distributors as supply conditions may vary.

Memory IC Selection Notes

Select this component for applications requiring high-density storage in a compact footprint with low power consumption. The dual-die design offers performance advantages over single-die counterparts. Ensure the host system supports the necessary SPI modes and voltage levels. Consider the 16-pin SOIC package for ease of integration in standard PCB layouts.

Memory IC Part Context

This part belongs to the W25Q01NW family of SpiFlash memories, characterized by their dual-die construction and 1.8V operation. It is designed to provide flexibility and performance beyond ordinary serial flash devices, targeting consumer and industrial applications where space and power efficiency are critical constraints.