Memory IC W638GU6QB-11 TR product image

W638GU6QB-11 TR

$10.75
  • Description:8GB DDR3L 1.35V SDRAM, X16, 933M
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:5178e05d62bd Category: Brand:

  
  • Quantity
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W638GU6QB-11 TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is 8GB DDR3L 1.35V SDRAM, X16, 933M. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W638GU6QB-11 TR

  • Description:8GB DDR3L 1.35V SDRAM, X16, 933M
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:8Gbit
  • Memory Organization:512M x 16
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-VFBGA (7.5x13)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for W638GU6QB-11 TR

W638GU6QB-11 TR

Memory IC Overview

The W638GU6QB-11 TR is a 8 Gbit DDR3L SDRAM manufactured by Winbond Electronics. It features a 16-bit data bus width and supports a maximum clock frequency of 933 MHz. The device operates within a voltage range of 1.283 V to 1.45 V and is housed in a VFBGA-96 package with an industrial temperature rating from -40°C to +95°C.

Memory IC Feature Summary

  • Supports low voltage operation for reduced power consumption
  • Industrial temperature range for extended environmental reliability
  • High-speed synchronous dynamic random access memory architecture

Memory IC Applications

  • Industrial control systems
  • Automotive electronics
  • Communication equipment

Memory IC Procurement Notes

Verify component authenticity through authorized channels. Confirm the specific suffix indicates tape and reel packaging. Check for end-of-life notifications as discontinuation status may affect long-term availability. Ensure compatibility with existing system designs before procurement.

Memory IC Selection Notes

Select this part for applications requiring high density and wide operating temperature ranges. Compare pinout and electrical characteristics against existing designs. Verify that the VFBGA-96 package fits the target PCB layout constraints. Consider thermal management requirements for industrial environments.

Memory IC Part Context

This component belongs to Winbond's DDR3L family, designed for demanding applications. It offers improved performance over standard DDR3 while maintaining lower power usage. The industrial grade ensures stability in harsh conditions where commercial parts might fail.

Memory IC Replacement Considerations

Check for direct pin-to-pin replacements within the same manufacturer's portfolio. Verify that any substitute maintains the same voltage and speed specifications. Ensure the alternative package matches the physical footprint requirements.

W638GU6QB-11 TRW638GU6QB-11 TR
$10.75
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