W66BP2NQQAGJ

Memory IC Overview

The W66BP2NQQAGJ is a 2 Gbit LPDDR4 SDRAM manufactured by Winbond Electronics. It features a memory organization of 64 M x 32 and operates with a maximum clock frequency of 2.133 GHz. The device supports a data rate of 1866 MHz and has an access time of 3.6 ns. Power supply voltage ranges from 1.7 V to 1.95 V. It is housed in a 200-TFBGA (10x14.5) package and functions within a temperature range of -40°C to +105°C.

Memory IC Feature Summary

• Supports LPDDR4 technology for mobile applications
• High-speed interface with 1866 MHz data rate capability
• Wide operating temperature range suitable for industrial environments

Memory IC Applications

• Mobile consumer electronics
• Industrial control systems
• Automotive infotainment units

Memory IC Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix indicates tape and reel packaging if required for automated assembly. Check current lifecycle status as end-of-life notifications may impact long-term availability. Ensure moisture sensitivity level handling procedures are followed during storage and soldering processes.

Memory IC Selection Notes

Select this component when a 2 Gbit capacity with a 32-bit bus width is required. Ensure the design accommodates the 200-TFBGA footprint and thermal requirements. Verify that the system power rails support the specified 1.7 V to 1.95 V range. Consider the -40°C to +105°C rating for environmental compatibility.

Memory IC Part Context

This part belongs to Winbond's LPDDR4 family, designed for high-performance mobile and embedded applications. It complements other densities in the series, offering a balance between bandwidth and power efficiency. The TFBGA package allows for compact board layouts in space-constrained devices.

Memory IC Replacement Considerations

Check for equivalent parts with matching pinout and electrical specifications. Verify that any substitute maintains the same memory organization and speed grade. Ensure thermal and mechanical constraints are compatible with the existing PCB design.