W979H2KBVX2E

$3.14

Description：IC DRAM 512MBIT PAR 134VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray

SKU:a025a3037670 Category: Memory IC Brand: Winbond Electronics

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Product introduction

W979H2KBVX2E is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 512MBIT PAR 134VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W979H2KBVX2E

Description：IC DRAM 512MBIT PAR 134VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - Mobile LPDDR2
Memory Size：512Mbit
Memory Organization：16M x 32
Memory Interface：Parallel
Clock Frequency：400 MHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.14V ~ 1.95V
Operating Temperature：-25°C ~ 85°C (TC)
Mounting Type：Surface Mount
Package / Case：134-VFBGA
Supplier Device Package：134-VFBGA (10x11.5)
Access Time：-

Memory IC datasheet and documents for W979H2KBVX2E

W979H2KBVX2E

Memory IC Overview

The W979H2KBVX2E is a 512Mb LPDDR2 SDRAM manufactured by Winbond Electronics. It features a 32-bit data bus width and operates at a maximum clock frequency of 400 MHz. The device is housed in a 134-ball VFBGA package with dimensions of 10x11.5 mm. Memory organization is specified as 16M x 32. Operating voltage ranges from a minimum of 1.14 V to a maximum of 1.95 V. The component supports an operating temperature range from -25°C to +85°C.

Memory IC Feature Summary

Supports LPDDR2-S4B interface technology for mobile applications
Includes ZQ calibration command for output driver impedance adjustment
Features partial array self-refresh capability with bank masking

Memory IC Applications

Mobile devices requiring low power consumption
Portable consumer electronics
Embedded systems utilizing LPDDR2 memory interfaces

Memory IC Procurement Notes

Verify the specific ordering suffix against official documentation, as it determines package type and temperature grade. Confirm current lifecycle status directly with the manufacturer or authorized distributors, as availability may be restricted. Ensure compliance with RoHS3 specifications and moisture sensitivity level requirements during storage and handling.

Memory IC Selection Notes

Select this component when a 512Mb capacity with a 32-bit parallel interface is required. Verify that the system design accommodates the 134-ball VFBGA footprint. Ensure the application environment remains within the specified -25°C to +85°C temperature range and utilizes the correct supply voltage levels between 1.14 V and 1.95 V.

Memory IC Part Context

This part belongs to the W979H series of LPDDR2 memory devices produced by Winbond Electronics. The series includes variants with different capacities and bus widths, such as the W979H6KB. These components are designed for mobile and portable electronic applications requiring high-density memory solutions.