SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The WG160SAD15SY-2 is a rectangular MIL-Spec connector from the AirBorn W Series, manufactured by Molex. It functions as a board mount receptacle featuring 160 positions arranged in three rows with socket contacts. The component utilizes through-hole termination and operates at a 2.54 mm pitch. Constructed with a Polyphenylene Sulfide (PPS) body and gold-plated copper alloy contacts, it supports a current rating of 5 A and a voltage rating of 1 kV. The unit maintains an insulation resistance of 5 GOhms and withstands temperatures between -65 C and +125 C.
Verify the specific polarization code and tail length requirements against the design schematic before ordering. Confirm that the supplier provides original manufacturer documentation to ensure compliance with MIL-DTL-55302 standards. Check for any RoHS certification details if environmental regulations apply to the final assembly. Ensure compatibility with mating plugs regarding contact orientation and hardware configuration.
Select this model when a straight-mount receptacle with 160 circuits is required. The three-row configuration maximizes density within standard form factors. Verify that the 2.54 mm pitch aligns with the PCB layout constraints. Consider the operating temperature range and voltage ratings to ensure suitability for the specific electrical environment. Match the polarization settings to prevent incorrect mating with other series components.
This component belongs to the AirBorn W Series, a line of rectangular connectors designed for harsh environments. The series offers various row counts and contact configurations to support diverse connectivity needs. Manufactured under Molex, these connectors adhere to rigorous military specifications. The WG160 variant specifically addresses applications requiring high pin counts in a compact footprint.
M55302/60-C160Y-2 serves as a confirmed substitute part number for this component. Ensure mechanical dimensions and electrical characteristics match exactly when swapping suppliers.

Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More