Field Programmable Gate Array XC2V250-5FGG456I product image

XC2V250-5FGG456I

  • Description:IC FPGA 200 I/O 456FBGA
  • Series:Virtex®-II

SKU:232c5f9d3119 Category: Brand:

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XC2V250-5FGG456I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 200 I/O 456FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XC2V250-5FGG456I

  • Description:IC FPGA 200 I/O 456FBGA
  • Series:Virtex®-II
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:384
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:442368
  • Number of I/O:200
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:456-BBGA
  • Supplier Device Package:456-FBGA (23x23)
  • Number of Gates:250000

Field Programmable Gate Array datasheet and documents for XC2V250-5FGG456I

XC2V250-5FGG456I

Field Programmable Gate Array Overview

The XC2V250-5FGG456I is a Virtex-II Field Programmable Gate Array manufactured by Xilinx, now part of AMD. It utilizes a 0.15 µm CMOS process and operates with a 1.5 V core voltage (VCCINT). The device features 250K system gates, 1,536 slices within its Configurable Logic Blocks (CLBs), and supports up to 200 user I/Os in the FG456 package. Key architectural resources include 24 dedicated 18-bit x 18-bit multiplier blocks and 432 Kb of Block SelectRAM memory. It incorporates eight Digital Clock Manager (DCM) modules for clock synthesis and distribution.

Field Programmable Gate Array Feature Summary

  • Supports high-speed serial interfaces including LVDS and LDT signaling standards via programmable I/O blocks.
  • Integrates dedicated arithmetic logic with 18x18 multipliers and dual-port Block SelectRAM for efficient DSP operations.
  • Provides flexible clock management through DCM modules capable of frequency synthesis, phase shifting, and de-skewing.
  • Enables secure configuration using on-chip Triple Data Encryption Standard (DES) decryption.

Field Programmable Gate Array Applications

  • Telecommunications equipment requiring high-density logic and interface flexibility.
  • Networking infrastructure utilizing PCI-X and DDR memory protocols.
  • Video processing systems leveraging embedded memory and arithmetic resources.
  • DSP applications implementing filter structures and multiply-accumulate operations.

Field Programmable Gate Array Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm that the ordering suffix 'GG' indicates Pb-free wire-bond packaging as specified in official documentation. Ensure compliance with RoHS directives if lead-free construction is required for the specific application environment.

Field Programmable Gate Array Selection Notes

Select this model when designs require 250K system gates with a 1.00 mm pitch fine-pitch BGA footprint. Consider the FGG456 package variant specifically for Pb-free manufacturing requirements. Evaluate the 200 available user I/Os against interface needs, noting that flip-chip packages offer higher pin counts for equivalent gate densities.

Field Programmable Gate Array Part Context

This component belongs to the Virtex-II family, representing an early platform FPGA solution optimized for high performance. It bridges low-density and high-density design capabilities using IP cores. The architecture introduced significant enhancements in routing predictability and embedded memory density compared to preceding generations.

Field Programmable Gate Array Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Designers should consult official migration guides for subsequent families such as Spartan-3 or Virtex-4/5 for functional equivalents.

Field Programmable Gate Array FAQ

What does the 'GG' suffix indicate in the part number?

The 'GG' suffix denotes a Pb-free wire-bond Fine-Pitch Ball Grid Array (BGA) package with a 1.00 mm pitch.

How many Digital Clock Managers (DCMs) are included?

The XC2V250 device includes eight DCM blocks for clock distribution and management.

What is the maximum number of user I/Os supported?

In the FG456 package, the device supports a maximum of 200 user I/O pads.

XC2V250-5FGG456IXC2V250-5FGG456I

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