Soc System On Chip XCVM1402-1MSENSVF1369 product image

XCVM1402-1MSENSVF1369

$4,682.44
  • Description:IC VERSALPRIME ACAP FPGA 1369BGA
  • Series:Versal™ Prime

SKU:eb38754e9345 Category: Brand:

  
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XCVM1402-1MSENSVF1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1369BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVM1402-1MSENSVF1369

  • Description:IC VERSALPRIME ACAP FPGA 1369BGA
  • Series:Versal™ Prime
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:-
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.3GHz
  • Primary Attributes:Versal™ Prime FPGA, 1.2M Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1369-BFBGA
  • Supplier Device Package:1369-BGA (35x35)

Soc System On Chip datasheet and documents for XCVM1402-1MSENSVF1369

XCVM1402-1MSENSVF1369

Soc System On Chip Overview

The AMD XCVM1402-1MSENSVF1369 is a Versal Premium Adaptive SoC FPGA designed for high-performance data center and infrastructure applications. It integrates programmable logic, AI Engines, processing subsystems, and hardened IP on a single chip. The device utilizes a 7nm process technology with up to 58 billion transistors in the Versal Premium family. It features advanced packaging unifying chiplet technologies and High Bandwidth Memory (HBM). Key specifications include approximately 5,824 K system logic cells, 2,688,000 LUTs, and 11,520 DSP engines. The processing subsystem comprises dual-core Arm Cortex-A72 and dual-core Cortex-R5F processors. It supports high-speed serial transceivers up to 112 Gb/s PAM4 and includes PCIe Gen5 and 100G/600G Ethernet hardened IP.

Soc System On Chip Feature Summary

  • Integrates heterogeneous computing resources including programmable logic, AI vector engines, and Arm-based processing cores for complex system-on-chip designs.
  • Supports ultra-high bandwidth memory interfaces and advanced chiplet packaging to minimize data movement overhead and enhance power efficiency.
  • Includes hardened network and storage IP blocks such as PCIe Gen5 and multi-gigabit Ethernet controllers for direct line-rate connectivity.

Soc System On Chip Applications

  • Data center acceleration and cloud infrastructure
  • High-speed networking and telecom baseband processing
  • Radar and advanced signal processing systems

Soc System On Chip Procurement Notes

Verify the specific ordering part number against official AMD documentation to ensure correct package type, speed grade, and temperature range. Confirm that the required development tools, such as Vivado and Vitis, are compatible with the selected Versal series. Ensure supply chain partners are authorized to prevent counterfeit components. Check for any specific configuration file requirements or security settings needed for deployment.

Soc System On Chip Selection Notes

Select this model based on the required balance between programmable logic capacity and AI Engine performance. Evaluate the necessary I/O count and high-speed transceiver lanes for your interface requirements. Consider the thermal design power and cooling solutions required for the 4072-ball FCBGA package. Compare resource utilization against other Versal variants to optimize cost and performance for the target workload.

Soc System On Chip Part Context

This component belongs to the AMD Xilinx Versal Premium Adaptive SoC family. It represents a convergence of adaptive compute, AI, and processing technologies. The Versal architecture is distinct from standard FPGAs by integrating fixed-function accelerators and ARM cores alongside programmable fabric. This family targets enterprise markets requiring scalable, energy-efficient hardware acceleration for emerging workloads like AI inference and high-throughput data analytics.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and pinout may include other Versal Premium models with adjusted resource counts, such as the XCVM1402-1MSESVF1369. Cross-generation compatibility requires careful verification of toolchain support and architectural differences. Substitutes must match the specific speed grade and temperature rating to maintain system reliability.

XCVM1402-1MSENSVF1369XCVM1402-1MSENSVF1369
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