XCVP1802-1MSELSVC4072

Soc System On Chip Overview

The XCVP1802-1MSELSVC4072 is an AMD Xilinx Versal Premium Adaptive SoC FPGA designed for high-performance computing and data center acceleration. It integrates a heterogeneous architecture combining programmable logic, AI Engines, and processing systems on a single chip. The device features approximately 7,352 K system logic cells, 3,360,896 LUTs, and 14,352 DSP engines. The processing subsystem includes dual-core Arm Cortex-A72 processors and dual-core Arm Cortex-R5F real-time cores. It utilizes a 4072-ball FCBGA package with extensive connectivity options including high-speed GT transceivers supporting up to 112 Gb/s PAM4.

Soc System On Chip Feature Summary

• Heterogeneous adaptive architecture integrating programmable logic, AI vector engines, and hardened IP for optimized workload distribution
• High-density processing subsystem with dual-core Arm Cortex-A72 application processors and dual-core Arm Cortex-R5F real-time controllers
• Extensive I/O connectivity via numerous high-speed serial transceivers supporting advanced signaling rates for network and storage interfaces

Soc System On Chip Applications

• Data center network and storage acceleration
• 5G xHaul and OTN networking infrastructure
• Radar and high-end signal processing systems

Soc System On Chip Procurement Notes

Verify the specific ordering suffix and speed grade against the official AMD datasheet to ensure compatibility with your design requirements. Confirm availability through authorized distributors as supply levels may vary. Ensure that the procurement channel provides genuine components with traceability documentation to maintain hardware integrity and support warranty claims effectively.

Soc System On Chip Selection Notes

Select this model when requiring large-scale parallel processing capabilities combined with low-latency control functions. Evaluate the thermal management requirements due to the high power consumption associated with the premium series logic density. Consider the PCB layer count and signal integrity constraints imposed by the 4072-ball BGA package and high-speed SERDES channels during the initial hardware design phase.

Soc System On Chip Part Context

This component belongs to the AMD Xilinx Versal Premium series, which targets demanding applications in telecommunications, industrial automation, and enterprise infrastructure. It sits above the Prime series in terms of logic capacity and AI engine resources, offering a scalable solution for complex adaptive computing tasks that require significant on-chip flexibility and computational throughput.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and pinout include other variants of the XCVP1802 family such as the XCVP1802-2MSILSVC4072 or XCVP1802-3HS... depending on the required speed grade and feature set. Verify electrical compatibility and timing specifications before substitution.