XCZU43DR-L2FSVE1156I

Soc System On Chip Overview

The XCZU43DR-L2FSVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a Processing System with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors alongside programmable logic and integrated RF data converters. The component utilizes an FCBGA-1156 package, measuring 35x35 mm. The suffix 'L2' indicates the second speed grade within the series, while 'I' denotes industrial temperature range operation from -40°C to 100°C. This SoC architecture supports high-performance signal processing tasks through its combined FPGA fabric and dedicated analog-to-digital/digital-to-analog conversion capabilities.

Soc System On Chip Feature Summary

• Integrated Zynq UltraScale+ RFSoC architecture combining ARM processors, FPGA logic, and RF transceivers
• FCBGA-1156 package (35x35 mm) suitable for space-constrained high-density designs
• Industrial temperature rating (-40°C to 100°C TJ) for robust environmental operation
• Speed grade L2 providing specific timing performance characteristics within the XCZU43DR family

Soc System On Chip Applications

• Software-defined radio systems requiring direct RF sampling
• 5G New Radio baseband processing and Massive MIMO beamforming
• Electronic warfare and signal intelligence platforms
• Advanced radar systems and satellite communication terminals

Soc System On Chip Procurement Notes

Verification of this specific part number requires consulting official AMD distribution channels or authorized partners. Availability may be limited due to specialized manufacturing requirements. Buyers should confirm current production status and lead times directly with suppliers. Ensure that the ordering information matches the exact suffix codes for speed grade and temperature rating to avoid functional mismatches in critical applications.

Soc System On Chip Selection Notes

Select the XCZU43DR-L2FSVE1156I when system requirements demand the specific resource count and speed grade associated with the L2 variant of the XCZU43DR series. Compare against other speed grades (e.g., L1, L3) to balance performance needs against cost and power consumption. Verify that the 1156-pin package fits the PCB layout constraints and thermal management strategy. Confirm compatibility with the required DDR memory interfaces and peripheral connectivity options supported by the Processing System.

Soc System On Chip Part Context

This component belongs to the AMD Zynq UltraScale+ RFSoC family, specifically the DR sub-series designed for high-channel-count RF applications. It shares architectural similarities with other devices in the XCZU43DR lineup but differs in speed grading and specific configuration options defined by the full part number. The RFSoC technology distinguishes it from standard MPSoC devices by integrating high-speed ADCs and DACs directly onto the silicon die.

Soc System On Chip Replacement Considerations

Direct replacements must match the XCZU43DR family, FCBGA-1156 package, and L2 speed grade. Alternative parts within the same series with different speed grades (e.g., L1 or L3) may require timing verification. Cross-family migration to other RFSoC models involves significant redesign of both hardware and software due to varying resource counts and pinout configurations.