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XCZU47DR-1FSVE1156I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC ZUP RFSOC A53 FPGA 1156BGA. Review the specifications below when checking this part for your BOM.
The AMD XCZU47DR-1FSVE1156I is a Zynq UltraScale+ RFSoC device manufactured using 16nm FinFET technology. It integrates a Processing System (PS) with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, alongside Programmable Logic (PL) containing approximately 930K logic cells. The chip features an integrated RF subsystem with eight 14-bit RF-ADCs and eight 14-bit RF-DACs, supporting sampling rates up to 5 GSPS for ADCs and 9.85 GSPS for DACs. It utilizes a 1156-pin FCBGA package rated for industrial temperatures (-40°C to +100°C).
Verify the specific speed grade suffix '1' against design requirements, as it differs from the more common '2' grade in terms of timing performance. Confirm availability through authorized AMD distributors, as lead times may vary. Ensure the FCBGA-1156 thermal management solution meets the power dissipation needs of the full RF and logic load.
Select this model when eight independent RF channels are required for simultaneous transmit and receive operations. Compare the '1' speed grade against '2' or '3' grades if higher clock frequencies or tighter timing margins are needed. Verify that the 16nm process node aligns with the target power budget and form factor constraints compared to newer generation devices.
This component belongs to the Zynq UltraScale+ RFSoC family, specifically the 47DR variant known for its high channel count. It serves as a single-chip solution replacing traditional multi-component architectures involving separate ADCs, DACs, and FPGAs, thereby reducing board space and interconnect complexity.
Direct pin-to-pin replacements within the same package are limited. Consider the XCZU47DR-2FFVE1156I for higher speed grades or the XCZU49DR for increased logic resources. Cross-generation upgrades may require schematic and layout redesigns due to architectural changes.
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