Soc System On Chip XCZU47DR-L1FFVE1156I product image

XCZU47DR-L1FFVE1156I

$18,928.44
  • Description:IC ZUP RFSOC A53 FPGA LP 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC

SKU:799ec24a7cf7 Category: Brand:

  
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XCZU47DR-L1FFVE1156I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC ZUP RFSOC A53 FPGA LP 1156BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU47DR-L1FFVE1156I

  • Description:IC ZUP RFSOC A53 FPGA LP 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

Soc System On Chip datasheet and documents for XCZU47DR-L1FFVE1156I

XCZU47DR-L1FFVE1156I

Soc System On Chip Overview

The AMD XCZU47DR-L1FFVE1156I is a Zynq UltraScale+ RFSoC device manufactured using 16nm FinFET technology. It integrates a Processing System (PS) with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, alongside Programmable Logic (PL) containing approximately 930K logic cells and 4272 DSP slices. The device features eight 14-bit RF-ADCs sampling at up to 5 GSPS and eight 14-bit RF-DACs operating at up to 9.85 GSPS. Encased in a 1156-pin FCBGA package measuring 35x35 mm, this specific variant operates within an industrial temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

  • Integrated 8-channel 14-bit RF-ADC (5 GSPS) and 8-channel 14-bit RF-DAC (9.85 GSPS) for direct RF sampling
  • Heterogeneous architecture combining quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors with FPGA fabric
  • Industrial temperature rating (-40°C to +100°C TJ) ensuring stability in harsh environments
  • High-performance PL resources including 930K logic cells and extensive DSP capabilities for complex signal processing

Soc System On Chip Applications

  • Software Defined Radio (SDR) systems
  • 5G New Radio (NR) base stations and Massive MIMO arrays
  • Phased array radar and electronic warfare systems
  • Wideband signal intelligence and spectrum monitoring equipment

Soc System On Chip Procurement Notes

Verify the exact speed grade suffix against official AMD documentation, as 'L1' typically denotes Low Power variants which may differ from standard performance grades. Confirm availability through authorized distributors, as lead times can vary significantly due to high demand in defense and telecom sectors. Ensure compatibility with required cooling solutions given the power density of the FCBGA package.

Soc System On Chip Selection Notes

Select this model when industrial temperature resilience (-40°C to +100°C) is mandatory. Compare against the '-2' speed grade if higher clock frequencies are not required, as the 'L1' designation often implies optimized power consumption. Evaluate the 930K logic cell count against algorithm complexity to ensure sufficient PL resources for beamforming or filtering tasks without over-provisioning.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ RFSoC family, specifically the 47DR series characterized by its dense integration of RF data converters and FPGA logic. It serves as a successor to earlier Xilinx SoC architectures, designed to replace multi-chip RF front-ends with a single-system solution. The 'I' suffix distinguishes it from commercial-grade parts by certifying operation across extended temperature ranges suitable for outdoor or ruggedized deployments.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other 47DR variants such as XCZU47DR-1FFVE1156I or XCZU47DR-2FFVE1156I. Verify that the thermal and electrical characteristics of the substitute match the system's power budget and timing requirements, particularly regarding the ARM processor frequencies and RF converter sampling rates.

XCZU47DR-L1FFVE1156IXCZU47DR-L1FFVE1156I
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