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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in the image sensor and camera family are component or module-level devices used to electronically capture visual information in the visible and/or infrared spectrums. Consisting of an array of photosensitive elements connected to a shared control and interface mechanism, available products include those adapted to common still image and video capture as well as more specialized applications such as thermal and spatial imaging.
MT9T111D00STCK26AC1-200View Product
AS0142ATSC00XUSM0-TPBRView Product
OV02736-H46A-1CView Product
KAI-11002-ABA-CD-B0View Product
OV07955-E53V-RDView Product
NE2D_B&W_F2.7_FOV90_LCC_V1.0 FT SEView Product
CMV2000-3E12M1LPView Product
DATAVS1-08-DC-KView Product
MT9M021IA3XTC-DPBR1View Product
OV02180-GA5AView Product
KAF-50100-AAA-JD-BAView Product
AS0149ATSC00XUEA1-TRBRView Product
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
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Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
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See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
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CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
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The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
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Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
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Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
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TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
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In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
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