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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
FH12-15S-0.5SVView Product
66987-004LFView Product
62684-342100ALFView Product
006216024111808A+View Product
F3051A7H111059E200View Product
67000-015LFView Product
1-88179-4View Product
1-487769-1View Product
FH41-50S-0.5SHView Product
66987-013LFView Product
10064555-272520HLFView Product
1-487378-3View Product
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
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Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
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Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
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Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
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Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
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The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
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TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
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