SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Digital Isolators electrically separate circuits but still allow for digital signals to be transferred between them. The technology types are capacitive coupling, giant magnetoresistive (GMR), or magnetic coupling. The number of channels range from 1 to 10 and the channel types can be bidirectional, unidirectional, or both.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() ADUM1300ARWZ $6.33 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Tube | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
![]() ADUM1300ARWZ-RL $6.33 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Tape & Reel (TR),Cut Tape (CT) | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
![]() ADUM1300BRW $3.92 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Tube,Tube | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
![]() ADUM1300BRW-RL $3.72 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Bulk | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
![]() ADUM1300BRWZ $6.58 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Tube | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
![]() ADUM1300BRWZ-RL $6.58 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Tape & Reel (TR),Cut Tape (CT) | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
![]() ADUM1300CRW $5.24 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Tube,Tube | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
![]() ADUM1300CRW-RL $5.24 | Analog Devices Inc. | DGTL ISOLTR 2.5KV 3CH GP 16-SOIC | Tape & Reel (TR),Bulk | 16-SOIC | Surface Mount | iCoupler® | -40°C ~ 105°C |
ISOS141FDBQTSEPView Product
MAX14938GWE+TView Product
MAX22245BAWA+View Product
ADUM1254ASA+View Product
SI8652EB-AUView Product
SI8642BA-C-IURView Product
ADUM3400WBRWZ-RLView Product
ADUM3211CRZView Product
SI8712BC-B-ISView Product
SI86S640BE-IS2RView Product
LTC4310CDD-1#TRPBFView Product
SI8662EB-B-IUView Product
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More