SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

A Field Programmable Gate Array (FPGA) is a programmable integrated circuit that allows users to implement customized hardware logic configurations after manufacturing. FPGAs are user-configurable and are widely used for performing logical operations and information processing, often in applications demanding real-time performance and extremely high speeds. With a very high level of integrated functionality, FPGAs can replace general-purpose microprocessors in systems where known operations—such as receiving and processing data from high-speed data converters—need to be executed rapidly and deterministically. Unlike fixed-function chips, FPGAs are reprogrammable, meaning they can be configured multiple times using hardware description languages like Verilog. At the heart of an FPGA are configurable logic blocks (CLBs), programmable interconnects, logic gates, and flip-flops, which are organized into a flexible architecture called a gate array. These components support complex logic creation, digital signal processing, and extensive parallel processing. Typically, FPGAs require an external memory device—often flash memory or read-only storage—to hold the configuration data and reload it upon each startup. This makes them particularly well-suited for telecommunications, data center infrastructure, and advanced embedded systems where both performance and low power consumption are critical. FPGAs serve as a software-defined hardware platform, allowing designers to build custom processor logic or accelerate functions beyond what a typical microcontroller can handle. The flexibility to reconfigure them makes FPGAs a key technology for prototyping, evolving product designs, and deploying real-time hardware solutions.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
| Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
![]() 5SGXMA3E1H29I2G $7,259.27 | Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | -40°C ~ 100°C (TJ) |
| Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | -40°C ~ 100°C (TJ) | |
| Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | -40°C ~ 100°C (TJ) | |
![]() 5SGXMA3E2H29C1G $7,130.02 | Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) |
| Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
| Altera | IC FPGA 600 I/O 780HBGA | Tray | 780-HBGA (33x33) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) |
5SGXMA5N3F45I3GView Product
10AX115N3F45I2SGE2View Product
10M02DCU324A7GView Product
XCKU095-1FFVB2104CView Product
5SGXMA3K2F35I3WNView Product
10AX048K2F35E1SGView Product
5SGXEA7K3F40I4NView Product
XC7A35T-L2CSG325EView Product
EP1AGX90EF1152I6NView Product
TI180J484C4View Product
A40MX04-2PL84View Product
1ST250EU2F50I1VGView ProductSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More