SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

This type of header (receptacle) contains female sockets within a plastic housing and is meant to be mated with a rectangular cable connector or a male pin header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 310-83-124-41-105101 $3.20 | Preci-Dip | CONN SOCKET 24POS 0.1 GOLD SMD | Bulk | Surface Mount | 310 | -55°C ~ 125°C | |
![]() 310-83-124-41-205101 $3.06 | Preci-Dip | CONN SOCKET 24P 0.1 GOLD SMD R/A | Bulk | Surface Mount, Right Angle | 310 | -55°C ~ 125°C | |
![]() 310-83-125-01-609101 $3.22 | Preci-Dip | CONN SOCKET 25POS 0.2 GOLD PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
![]() 310-83-125-01-640101 $2.62 | Preci-Dip | CONN SOCKET 25POS 0.1 GOLD PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
![]() 310-83-125-01-666101 $2.41 | Preci-Dip | CONN SOCKET 25POS 0.1 GOLD PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
![]() 310-83-125-01-754101 $2.63 | Preci-Dip | CONN SOCKET 25POS 0.1 GOLD PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
![]() 310-83-125-41-001101 $2.14 | Preci-Dip | CONN SOCKET 25POS 0.1 GOLD PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
![]() 310-83-125-41-105101 $3.42 | Preci-Dip | CONN SOCKET 25POS 0.1 GOLD SMD | Bulk | Surface Mount | 310 | -55°C ~ 125°C |
SSM-112-F-SV-KView Product
315-44-116-41-003000View Product
SFMC-103-L2-SM-D-TRView Product
A25204-012View Product
ESQ-118-13-L-DView Product
DF3-3S-2DSA(20)View Product
15453164View Product
833-87-074-30-001101View Product
ESQT-112-03-G-D-375View Product
CLT-130-02-H-D-BE-A-TRView Product
SSW-105-01-S-QView Product
SMM-113-02-SM-D-LC-TRView Product
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More