10-88-1305

Headers, Male Pins Overview

The Molex 10-88-1305 is a rectangular header connector featuring 30 positions with a 2.54mm pitch. It utilizes right-angle mounting orientation and through-hole soldering termination for PCB integration. The component is designed for reliable signal transmission in standard electronic assemblies requiring dense pin configurations.

Headers, Male Pins Feature Summary

• Right-angle mounting configuration for space-efficient PCB layout
• Through-hole soldering termination for secure board attachment
• Rectangular header design with 30-position density

Headers, Male Pins Applications

• General electronic circuit board interconnections
• Signal transmission modules
• Industrial control panel wiring

Headers, Male Pins Procurement Notes

Verify the specific datasheet version to confirm material specifications and plating details. Ensure compatibility with mating connectors regarding pitch and row configuration. Check for any updated environmental compliance certifications required by your manufacturing region before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a right-angle, 30-pin header with 2.54mm spacing is required. Consider the through-hole mounting constraint against surface-mount alternatives. Evaluate the mechanical stability needs of the assembly against the standard header profile provided by this specific model number.

Headers, Male Pins Part Context

This part belongs to the Molex rectangular header series, widely used in consumer electronics and industrial equipment. It represents a standard interconnect solution for connecting cables or secondary boards to main PCBs, offering a balance of density and mechanical reliability in compact form factors.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 30-position count, 2.54mm pitch, right-angle orientation, and through-hole termination method. Verify that alternative manufacturers provide identical housing dimensions and contact plating specifications to ensure functional interchangeability without re-engineering the PCB footprint.