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10-89-1086 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Molex. Its product description is CONN HEADER R/A 8POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Molex 10-89-1086 is a pin header connector designed for board-to-board and wire-to-board interconnections. It features a 2.54 mm pitch with two rows and eight contacts, utilizing through-hole straight mounting for secure PCB attachment. The component employs tin-plated contacts to ensure reliable signal transmission and corrosion resistance in standard operating environments.
Verify the specific part number against official Molex documentation to confirm compatibility with your design requirements. Ensure that the supplier provides genuine components sourced directly from authorized channels. Cross-reference technical specifications such as contact material and pitch to guarantee alignment with your application's electrical and mechanical constraints before finalizing procurement decisions.
Select this connector when a low-profile, double-row header is required for direct PCB integration. Consider the 2.54 mm pitch for standard spacing compatibility and evaluate the through-hole mounting method for applications requiring high mechanical stability. Assess environmental conditions to determine if additional coating or material specifications are necessary beyond standard tin plating.
This component belongs to the Molex pin header series, which focuses on providing versatile interconnection solutions for various electronic industries. The 10-89 series typically offers standardized dimensions and reliable performance for general electronic applications, serving as a fundamental building block for circuit board assembly and signal routing in modern electronic devices.
Consult Molex cross-reference tools to identify parametrically similar parts. Verify that any substitute matches the 2.54 mm pitch, 2x8 contact count, and through-hole mounting style. Ensure the replacement maintains equivalent contact material properties and mechanical durability for seamless integration.
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