10-89-1741

Headers, Male Pins Overview

The Molex 10-89-1741 is a vertical header connector from the C-Grid 8624 series, designed for board-to-board or cable applications. It features an unshrouded configuration with male pins and utilizes through-hole mounting for structural integrity. The component provides 74 total positions with a row-to-row mating distance of 0.100 inches (2.54mm).

Headers, Male Pins Feature Summary

• Vertical orientation design for standard PCB integration.
• Male pin contact type ensures secure mechanical connection.
• Through-hole mounting style provides robust structural stability.

Headers, Male Pins Applications

• Board-to-board interconnections
• Cable to board connections
• Switch or mechanical element interfaces

Headers, Male Pins Procurement Notes

Verify the specific revision status and RoHS compliance documentation directly with Molex authorized distributors before procurement. Confirm that the unshrouded header design aligns with the target assembly's safety and spacing requirements. Ensure sourcing channels are official to guarantee component authenticity and traceability.

Headers, Male Pins Selection Notes

Select this part when a high-density 74-position vertical header is required. The 2.54mm pitch suits standard industrial and consumer electronics layouts. Consider the unshrouded design implications for mating clearance and ensure through-hole processing capabilities are available in the manufacturing workflow.

Headers, Male Pins Part Context

This component belongs to the Molex C-Grid 8624 series, which focuses on reliable vertical headers. The series supports various position counts and contact types, serving as a versatile solution for general-purpose electronic interconnects in diverse industrial and commercial equipment applications.

Headers, Male Pins Replacement Considerations

Consult Molex cross-reference tools for parametrically similar parts. Verify that any substitute maintains the 2.54mm pitch, 74-position count, and vertical through-hole mounting characteristics to ensure compatibility with existing footprints and assembly processes.