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1N4150_T50A is listed in the Single Diodes range at ChipApex. The manufacturer field lists onsemi. Its product description is DIODE STANDARD 50V 200MA DO35. Review the specifications below when checking this part for your BOM.
The onsemi 1N4150_T50A is a high conductance ultra-fast silicon diode housed in the DO-35 axial leaded package. It features a working inverse voltage of 50 V and an average rectified current rating of 200 mA. The device exhibits a maximum breakdown voltage of 75 V at 5.0 μA reverse current, with low leakage characteristics of 100 nA at 50 V and 25°C. Electrical performance includes a forward voltage of up to 1.0 V at 200 mA and a reverse recovery time ranging from 4.0 ns to 6.0 ns depending on current levels. Thermal resistance is specified at 300 °C/W.
Verify the specific T50A suffix against official documentation to confirm reel packaging specifications and quantity per unit. Ensure compatibility with automated placement equipment regarding the DO-35 form factor. Cross-reference the manufacturer part number with current datasheets to validate electrical parameters before integration into final designs.
Select this component when circuit requirements demand rapid switching speeds combined with moderate current handling capabilities. The DO-35 package provides reliable through-hole mounting for standard PCB layouts. Evaluate thermal management needs based on the 300 °C/W junction-to-ambient resistance rating under expected operating conditions.
This discrete power and signal diode belongs to the high-conductance ultra-fast series manufactured by onsemi (formerly Fairchild Semiconductor). It utilizes silicon epitaxial planar technology to achieve superior switching performance compared to standard general-purpose diodes while maintaining robust reliability for industrial and commercial electronic applications.
Consult official substitution guides for equivalent ultra-fast diodes with matching voltage and current ratings. Verify pinout compatibility and package dimensions to ensure direct replacement feasibility without modifying existing board layouts or assembly processes.
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