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1N4573/TR is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ZENER 6.4V 500MW DO7. Review the specifications below when checking this part for your BOM.
The Microchip Technology 1N4573/TR is a temperature-compensated Zener reference diode with a nominal voltage of 6.4 V. It operates at a test current (IZT) of 1.0 mA and features a maximum voltage temperature coefficient of 0.001 %/°C (0.06 mV/°C). The device has a maximum reverse leakage current of 2 µA at 3 V and a dynamic impedance of 100 Ohms at the test current. It is housed in a DO-7 (DO-204AA) glass axial-leaded package, dissipates up to 500 mW, and operates within a temperature range of -55°C to +100°C.
Verify that the ordering suffix 'TR' corresponds to the tape and reel packaging option as specified in the datasheet. Confirm the specific temperature range and tolerance requirements match the standard JEDEC registered specifications provided. Ensure compatibility with the DO-7 package dimensions for your PCB layout.
Select this component when a 6.4 V reference with a 0.001 %/°C temperature coefficient is required. The 1.0 mA test current setting offers a balance between power dissipation and stability. Consider the DO-7 through-hole package for manual assembly or automated insertion processes compatible with axial leads.
This part belongs to the 1N4565 thru 1N4584A-1 series of Zero-TC Reference Diodes manufactured by Microsemi (now Microchip Technology). The series provides various temperature coefficients and operating currents for 6.4 V nominal voltage applications. These diodes are hermetically sealed in glass cases and are suitable for high-reliability environments.
Public confirmed substitute part numbers include 1N4573A.
The maximum voltage temperature coefficient is 0.001 %/°C, which equates to 0.06 mV/°C.
The standard 1N4573 does not inherently possess military qualifications. Military versions require specific prefixes (JAN, JANTX, JANTXV) and the '-1' suffix for internal metallurgical bonding.
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