1SX280LU3F50E2VG

Soc System On Chip Overview

The Altera 1SX280LU3F50E2VG is a Stratix 10 SX System on Chip FPGA featuring 2,800,000 logic elements and 933,120 adaptive logic modules. It integrates 229 Mbit of embedded memory and supports 1,160 I/Os within a 2397-ball FBGA package. The device operates at a core voltage of 940 mV across a commercial temperature range of 0°C to +100°C. It includes 96 high-speed transceivers for serial communication.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-A53 hard processor system with FPGA fabric
• Supports high-speed serial data transmission via multiple transceivers
• Features advanced power management through SmartVID technology

Soc System On Chip Applications

• High-performance networking infrastructure equipment
• Industrial automation and control systems
• Telecommunications baseband processing units

Soc System On Chip Procurement Notes

Verify the complete part number against official Intel/Altera documentation to ensure correct package and speed grade. Confirm RoHS compliance status and humidity sensitivity level prior to procurement. Ensure supply chain sources provide valid traceability documents for this SoC FPGA component.

Soc System On Chip Selection Notes

Compare the 1SX280LU3F50E2VG against other Stratix 10 variants based on required transceiver count and I/O density. Evaluate thermal requirements for the 2397-ball FBGA package in the target application environment. Verify compatibility with Quartus Prime software versions supporting this specific device family.

Soc System On Chip Part Context

This component belongs to the Stratix 10 SX family, designed for cost-sensitive applications requiring significant logic capacity. It combines programmable logic with an embedded ARM processor. The device targets markets needing flexible hardware acceleration alongside general-purpose processing capabilities.

Soc System On Chip Replacement Considerations

Direct substitutes include other 1SX280 series devices with compatible pinouts. Check suffix variations for differences in temperature range or packaging. Consult official migration guides for any functional changes between generations.