SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 20130579 is a component within the PROLINE subrack and 19-inch chassis product line, designed for industrial electronics enclosure systems. It serves as an accessory or structural element for configuring modular rack environments that provide high flexibility and EMC shielding capabilities. The system conforms to IEC 60298-3-103 and IEEE 1011.10/11 standards, ensuring compatibility with standard 19-inch mounting formats. These assemblies are engineered for mobile rail applications, meeting shock and vibration testing requirements under IEC 61587-1, EN 50155, BN 411002, BN 411003, and NF F 61-005 / NF F 60-002 specifications. Constructed from aluminum or steel plate (AlZn coated), the components support both kit-from-stock availability and individual configuration options.
Verify the specific functional role of part number 20130579 within the complete PROLINE assembly kit, as it may be a supplementary accessory rather than a primary chassis unit. Confirm material composition (aluminum vs. steel) and coating type if environmental resistance is critical. Ensure compatibility with existing IEC 60298-3-103 compliant mounting rails. Cross-reference with the latest Main Catalogue Edition to confirm current stock availability versus custom configuration lead times.
Select this component when designing enclosures requiring certified compliance with railway and industrial vibration standards. Consider the PROLINE series for its flexibility in combining wall-mounted cases with subracks. Evaluate whether the AlZn coated steel or aluminum variant best suits the corrosion protection needs of the deployment environment. Verify that the physical dimensions align with the intended 19-inch module footprint and available rack depth.
This part belongs to the Schroff PROLINE family, which specializes in robust 19-inch chassis and subrack solutions. The series emphasizes modularity, allowing users to mix cabinets, wall-mounted cases, and subracks. The PROLINE line is distinctively qualified for harsh environments, particularly those involving transport and mobile machinery, distinguishing it from standard static rack solutions.
ON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More