SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 21130049 is a side panel component designed for the 21130 series subrack system. It features a height of 2000 mm and a depth of 300 mm, providing structural enclosure for electronic modules. The unit includes a lock mechanism designated as LOCK-7021 to secure the assembly within the rack frame. This component serves as a vertical boundary element in modular electronics packaging solutions.
Verify the specific model number 21130049 against your system requirements before ordering. Confirm that the 2000mm height and 300mm depth match your existing subrack infrastructure. Ensure compatibility with the LOCK-7021 hardware specification. Check manufacturer lead times as they may vary. Validate that this side panel corresponds to the correct series designation for your application.
Select this part when a fixed-height side panel is required for the 21130 series. The 2000mm dimension suits tall equipment racks. The 300mm depth aligns with standard module depths in this series. Consider the integrated lock feature if security is necessary. Verify mounting hole patterns match the subrack frame. Ensure the material specifications meet environmental requirements.
This component belongs to the nVent SCHROFF 21130 series, which offers modular subrack solutions for electronics packaging. The series provides flexible configurations for various industrial applications. Side panels like the 21130049 complete the mechanical structure of these racks. The product line emphasizes combinable and scalable design principles for robust equipment housing.
No public confirmed substitute part numbers are available for this specific component.
TOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More