SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 21130337 is a rack shelf component belonging to the Varistar series, designed for integration into 19-inch electronics cabinets. It features a steel construction finished in black and grey, providing a robust mounting solution for electronic modules. The unit has a height of 1U and an external depth of 702 mm, with a width of 544 mm. This stationary shelf supports a load capacity of up to 70 kg and includes perforations to facilitate assembly and ventilation within professional industrial and measurement technology environments.
Verify that the required depth matches the 702 mm specification, as this model is distinct from shallower variants in the same series. Confirm compatibility with the specific 19-inch cabinet frame being utilized. Ensure the 1U height aligns with available vertical space in the target enclosure. Check that the steel material and finish meet environmental requirements for the installation site.
Select this model when a fixed, high-capacity mounting platform is required rather than a sliding mechanism. The 702 mm depth accommodates deeper equipment profiles compared to standard shallow shelves. Consider the 70 kg load rating when planning dense module arrangements. The perforated design aids in cable management and airflow if active cooling is integrated nearby.
This component is part of the nVent SCHROFF Varistar series, which specializes in standardized rack solutions for professional applications. The series offers various depths and heights to customize cabinet interiors. As a rack shelf, it serves as a foundational element for organizing and securing electronic hardware within structured environments, ensuring stability and accessibility for maintenance.
Direct substitutes may include other Schroff 21130-series shelves with identical 702 mm depth and 1U height. Verify that any alternative maintains the 70 kg load capacity and perforated design characteristics. Cross-reference dimensions strictly to ensure fit within existing 19-inch frames without modification.

STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More