SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 22130579 is a Varistar EMC connection plate designed for recessed installation within electronic enclosures. It features an IP55 protection rating and is finished in RAL 7035 color. The component measures 400 mm in height and 800 mm in depth, with a specified recess depth of 40 mm. This plain plate serves as a mounting interface for electromagnetic compatibility applications.
Verify the exact dimensional tolerances and material specifications against the official nVent SCHROFF datasheet before procurement. Confirm that the RAL 7035 finish meets project aesthetic requirements. Ensure the 40 mm recess depth capability of the host enclosure aligns with this plate's design to guarantee proper fitment and IP55 sealing integrity during installation.
Select this part when a recessed EMC connection plate with IP55 protection is required for 400H x 800D rack systems. It is suitable for applications needing a plain surface for further labeling or component attachment. Verify compatibility with existing subrack frames and ensure the enclosure supports the necessary 40 mm recess depth for flush mounting.
This component belongs to the nVent SCHROFF Varistar series, which specializes in electronics packaging solutions. The product line includes racks, subracks, and accessories for industrial and telecommunications equipment. The 22130579 model specifically addresses EMC requirements within standard rack dimensions, providing a standardized interface for shielded installations.
No public confirmed substitute part numbers are available in the provided documentation. Consult nVent SCHROFF technical support for cross-reference options if this specific dimension or finish is unavailable.

In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More