SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 23130235 is a front panel component designed for integration into industrial chassis systems. It serves as a structural interface element, providing mounting points and alignment features for electronic modules within standardized rack environments. This specific part number represents a manufactured metal sheet component intended for secure attachment to the front of equipment enclosures.
Verify the exact dimensional specifications against the mechanical drawing provided in the official Schroff catalog or datasheet. Confirm that the material finish and hole pattern match the requirements of the target chassis system. Ensure compatibility with the specific series of brackets or rails being utilized in the assembly design.
Select this component based on the required chassis width and module height specifications. Ensure the mounting interface aligns with the existing rail or bracket system. Consider environmental factors such as corrosion resistance if the application involves harsh conditions. Verify that the component fits within the overall depth constraints of the enclosure design.
Schroff is a recognized manufacturer of network and IP control cabinets, sub-racks, and CPCI systems. The company provides comprehensive ATCA, AMC, and MTCA industrial chassis technologies. This part belongs to their range of structural components used in building robust electronic housing solutions.
No public confirmed substitute part numbers are available in the provided documentation. Cross-referencing with other manufacturers requires precise dimensional verification.

The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More