Edgeboard Connectors 2333799-3 product image

2333799-3

$14.23
  • Description:RCPT ASSY, VERT, 168 POS, SLIVER
  • Series:Sliver 2.0
  • Mfr:TE Connectivity AMP Connectors
  • Package:Tray

SKU:04350bff3fe2 Category: Brand:

  
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2333799-3 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is RCPT ASSY, VERT, 168 POS, SLIVER. Review the specifications below when checking this part for your BOM.

Edgeboard Connectors specifications for 2333799-3

  • Description:RCPT ASSY, VERT, 168 POS, SLIVER
  • Series:Sliver 2.0
  • Mfr:TE Connectivity AMP Connectors
  • Package:Tray
  • Card Type:Non Specified - Dual Edge
  • Gender:Female
  • Number of Positions/Bay/Row:28; 14; 28; 14
  • Number of Positions:168
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:0.024" (0.60mm)
  • Read Out:Dual
  • Features:Board Guide, Pick and Place, Solder Retention
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Contact Material:Copper Alloy
  • Contact Finish:Gold
  • Contact Finish Thickness:30.0µin (0.76µm)
  • Contact Type:-
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-55°C ~ 85°C

Edgeboard Connectors datasheet and documents for 2333799-3

2333799-3

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors 2333799-3 is a vertical rectangular cable assembly receptacle belonging to the Sliver 2.0 series. It features 168 positions arranged in a dual-row configuration with a 0.024-inch (0.60mm) pitch. Designed for surface mount termination, the connector utilizes gold-plated copper alloy contacts and an LCP insulator. It supports board thicknesses up to 0.062 inches and operates within a temperature range of -55°C to 85°C.

Edgeboard Connectors Feature Summary

  • Vertical orientation design for space-constrained PCB layouts
  • Gold-plated contacts ensure reliable signal transmission
  • LCP insulation material provides high thermal stability
  • Surface mount termination facilitates automated assembly

Edgeboard Connectors Applications

  • High-density data processing systems
  • Telecommunications infrastructure equipment
  • Industrial control modules requiring robust interconnects
  • Server backplane connections

Edgeboard Connectors Procurement Notes

Verify the specific contact finish thickness and plating process changes documented in recent Product Change Notifications prior to ordering. Confirm that the required board thickness aligns with the specified 0.062-inch maximum limit. Ensure compatibility with the Sliver 2.0 series mating components to maintain proper mechanical engagement and electrical performance during procurement.

Edgeboard Connectors Selection Notes

Select this component when high pin density is required in a compact vertical form factor. The 0.60mm pitch allows for significant I/O count within limited board areas. Consider the surface mount requirement and reflow soldering profile compatibility. Evaluate the operating temperature range against environmental conditions to ensure long-term reliability in the target application.

Edgeboard Connectors Part Context

This part belongs to the Sliver 2.0 family of high-speed interconnect solutions from TE Connectivity. The series is engineered for applications demanding high pin counts and small footprints. It complements other components in the ecosystem designed for rapid data transfer and stable mechanical connections in modern electronic assemblies.

Edgeboard Connectors Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify cross-compatibility with existing designs before considering alternative sources.

2333799-32333799-3
$14.23
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