2391643-3

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2391643-3 is a high-density connector system designed for surface mount applications. It features a dual-edge card edge configuration with 168 positions, providing robust interconnect capabilities for complex electronic assemblies. The contact pitch is specified at 0.024 inches (0.60mm), allowing for compact board layouts while maintaining signal integrity. The contacts are constructed from copper alloy and finished with gold plating to ensure reliable conductivity and corrosion resistance in demanding environments.

Edgeboard Connectors Feature Summary

• Dual-edge card edge interface design for secure board-to-board or backplane connections
• Surface mount termination method optimized for automated PCB assembly processes
• Gold-plated copper alloy contacts ensuring low contact resistance and durability

Edgeboard Connectors Applications

• High-density data transmission systems
• Telecommunications infrastructure equipment
• Industrial control modules requiring compact form factors

Edgeboard Connectors Procurement Notes

Verify the specific datasheet version and RoHS compliance status directly with the manufacturer before procurement. Confirm that the surface mount footprint matches the target PCB design exactly. Ensure storage conditions meet moisture sensitivity level requirements to prevent soldering defects during reflow processes.

Edgeboard Connectors Selection Notes

Select this component when a high pin count interface is required within a limited vertical space. The dual-edge design offers mechanical stability compared to single-edge alternatives. Evaluate thermal management needs as the dense packing may influence heat dissipation characteristics in enclosed enclosures.

Edgeboard Connectors Part Context

This component belongs to the broader family of TE Connectivity AMP high-density interconnect solutions. These connectors are engineered to support increasing bandwidth demands in modern electronics. The series typically includes various housing options and mating counterparts to create complete connectivity systems for specialized industrial and commercial applications.