SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24572002 is a 3U subrack kit designed for 19-inch mounting systems. Constructed from aluminum with a gray finish, it provides a chassis depth of 255mm and supports 42 HP card slots. The unit complies with RoHS standards and contains no SVHC substances. It serves as a structural housing for electronic modules within industrial control environments.
Verify the exact part number format, as sources list both hyphenated (24572-002) and non-hyphenated variants. Confirm material specifications and compliance status directly with the manufacturer or authorized distributor documentation before purchase to ensure alignment with project requirements.
Select this model when a 3U height and 255mm depth are required for 19-inch rack integration. Ensure compatibility with the specific card profile and cooling needs of the installed modules. Verify that the aluminum construction meets the environmental protection standards of the deployment site.
This component belongs to the Schroff subrack family, which provides standardized mechanical frameworks for electronic assemblies. These units are commonly used in conjunction with front panels, backplanes, and power supplies to create complete system enclosures for industrial and communication applications.
Publicly confirmed substitute part numbers are not available in the provided source data. Cross-referencing with official Schroff catalogs is recommended to identify equivalent models with matching dimensions and mounting configurations.

See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More